Process for the selective metallization of partial structures or regions comprises applying a conducting adhesive or producing a conducting path on a substrate, and selectively depositing metal on the conducting adhesive

摘要

Process for the selective metallization of partial structures or regions comprises: applying a conducting adhesive or producing a conducting path on a substrate; and selectively depositing metal on the conducting adhesive. An Independent claim is also included for a device for the selective metallization of partial structures or regions comprising a dispensing arrangement having a metallizing device (3) for the integrated deposition of the metal. Preferred Features: The metallizing device has a pin (4) for producing a conducting path, a capillary arrangement (5) for applying and removing electrolyte materials and an electrode arrangement (6) for galvanically depositing metal.