发明名称 Connector assembly and method
摘要 Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.
申请公布号 US9385457(B2) 申请公布日期 2016.07.05
申请号 US201414563641 申请日期 2014.12.08
申请人 Intel Corporation 发明人 Chawla Gaurav;Heppner Joshua D;Zhang Zhichao;Llapitan David J.;Krithivasan Vijaykumar
分类号 H01R24/28;H01R12/72;H01R12/79;H01R13/11;H01R12/71;H01L23/34;H01R12/70 主分类号 H01R24/28
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. A connector and package assembly comprising: a package including a die coupled along a substrate, the package includes: a side access port on a side of the package, anda contact array on a bottom of the package, the contact array arranged for coupling with a socket; a heat sink coupled over the die, and the side access port is between the heat sink and the substrate; and a connector including: a plug coupled with one or more of the package or substrate at the side access port, the plug having a plurality of contacts provided on two or more plug terraces, the two or more plug terraces are in a stepped arrangement, anda receptacle arranged for coupling with the plug and a cable, the receptacle having a plurality of contacts provided on two or more receptacle terraces, the two or more receptacle terraces are in a corresponding stepped arrangement to the two or more plug terraces.
地址 Santa Clara CA US