| 摘要 |
PROBLEM TO BE SOLVED: To cool a heating element such as a semiconductor module having pin fins, while preventing breakdown.SOLUTION: A cooling structure of a heating element has a heating element (600) formed by projecting a plurality of pin fins, and having at least one cooling surface, heat receiving plates (630A, 630B) including holes (633A, 633B) into which the pin fins are inserted loosely, at positions facing the pin fins, and a cooler having a pair of sandwiching members (601A, 601B) for sandwiching the heat receiving plates while pressing. The heating element (600) is cooled by bringing the sandwiching members (601A, 601B) and heat receiving plates (630A, 630B) into surface contact.SELECTED DRAWING: Figure 11 |
