| 发明名称 |
CIRCUIT BOARD, MULTILAYERED SUBSTRATE HAVING THE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD |
| 摘要 |
Disclosed is a circuit board that includes a core portion having a first via disposed therein in the general shape of an hourglass. The circuit board implements a finer via that penetrates a core and improves heat dissipation performance. The circuit board includes a core portion including a first core and a second core made of a metallic material, the first core and the second core being disposed adjacent to each other, and a first via penetrating the core portion. |
| 申请公布号 |
US2016192488(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514962428 |
申请日期 |
2015.12.08 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MIN Tae-Hong;KANG Myung-Sam;LEE Jung-Han;KO Young-Gwan |
| 分类号 |
H05K1/11;H05K3/00;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board comprising:
a core portion comprising a first core and a second core made of a metallic material, the first core and the second core being disposed adjacent to each other; and a first via penetrating the core portion. |
| 地址 |
Suwon-si KR |
