| 摘要 |
Disclosed is a sputtering device (1) provided with a vacuum chamber (11), a plurality of targets (132a-132d) arranged in parallel having a specified distance therebetween and disposed opposite of a substrate provided in the vacuum chamber, a power source to apply voltage to the targets, and a gas introduction means (12) for introducing gas into the vacuum chamber. The sputtering device also has shields (20) that cover the upper surfaces of the ends of the targets. |
