| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition showing little sedimentation of a filler during storage and giving a resin composition layer with superior stability of thickness, a low elastic modulus and sufficient low stress property, and to provide a semiconductor device excellent in reliability by using the liquid resin composition as a die attach paste for a semiconductor or an adhesive material for a heat sink member.SOLUTION: The liquid resin composition contains a compound (A) having one acrylic group and a filler (B), wherein when the transmittance of the compound (A) at 50°C and the transmittance at 0°C are denoted by Ta and Tb, respectively, Ta and Tb satisfy a conditional expression (1):(Ta-Tb)/Ta≥0.1. |
