| 摘要 |
A circuit board structure having an embedded semiconductor chip and a method for fabricating the same are disclosed. The circuit board structure includes: a carrier board formed with at least one through hole; a semiconductor chip received in the through hole of the carrier board, the semiconductor chip having an active surface and a non-active surface, wherein the active surface is provided with a plurality of electrode pads; a dielectric layer formed on surfaces of the carrier board and the semiconductor chip and formed with a plurality of openings for exposing the electrode pads of the semiconductor chip; and a composite circuit layer formed on the dielectric layer, including a thinned metal layer, conductive layer, and electroplated metal layer, and electrically connected to the electrode pads by conductive structures formed in the openings of the dielectric layer. Strong bonding provided by the composite circuit layer formed on the dielectric layer thus desirably reduces the warpage problem resulted from thermal effect.
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