| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting structure which hardly causes damage to an electronic component by vibration applied after mounting. <P>SOLUTION: In the electronic component mounting structure, a substrate 3 composed of an upper mount substrate 3a and a lower heat dissipation substrate 3b has a concave portion 5 from the top face of the mount substrate 3a to the middle of the heat dissipation substrate 3b. There are a plurality of electrode pads 4 formed around the concave portion 5, and lead terminals 2 are connected to the electrode pads 4. An electronic component 1 is connected to the plurality of lead terminals 2 and disposed in the concave portion 5 away from the bottom face and side faces of the concave portion 5. A space between the electronic component 1 and the concave portion 5 is filled with a resin material 7. Even if vibration is applied from the outside, the vibration is absorbed by the resin material 7 which fills the space around the electronic component 1, and thereby the electronic component 1 is hardly damaged. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
