发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board.SOLUTION: A wiring board includes silver thin wires formed on a substrate by a printing method. The silver thin wire, in a cross section of a direction perpendicular to the wire length direction, is 20 μm or less in width, and 0.013 or more and 0.025 or less in the aspect ratio. The width of the apex becomes smaller than a contact part with the substrate. Surface roughness of the sliver thin wire is 0.25 μm or more and 0.35 μm or less.SELECTED DRAWING: Figure 1
申请公布号 JP2016195243(A) 申请公布日期 2016.11.17
申请号 JP20160038422 申请日期 2016.02.29
申请人 TOPPAN FORMS CO LTD 发明人 KIMURA KENTARO;HIROSE HISAMI
分类号 H05K3/12;C09D11/52;H05K1/09 主分类号 H05K3/12
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