发明名称 |
Composite device with integrated diode |
摘要 |
There are disclosed herein various implementations of composite semiconductor devices. In one implementation, such a composite semiconductor device includes a transition body formed over a diode, the transition body including more than one semiconductor layer. The composite semiconductor device also includes a transistor formed over the transition body. The diode may be connected across the transistor using through-semiconductor vias, external electrical connectors, or a combination of the two. |
申请公布号 |
US9502398(B2) |
申请公布日期 |
2016.11.22 |
申请号 |
US201514794370 |
申请日期 |
2015.07.08 |
申请人 |
Infineon Technologies Americas Corp. |
发明人 |
Briere Michael A. |
分类号 |
H01L29/778;H01L27/02;H01L29/16;H01L29/20;H01L23/522;H01L23/532;H01L29/861;H01L29/868;H01L29/417;H01L21/8258;H01L27/06 |
主分类号 |
H01L29/778 |
代理机构 |
Murphy, Bilak & Homiller, PLLC |
代理人 |
Murphy, Bilak & Homiller, PLLC |
主权项 |
1. A composite semiconductor device comprising:
a diode including an anode and a cathode; a transition body formed over said cathode, said transition body including a plurality of semiconductor layers; a transistor formed over said transition body, said transistor including a source and a drain; said source being connected to said diode by a first electrical connector, wherein said first electrical connector is selected from the group consisting of a conductive metal clip, a conductive ribbon, and a bond wire; said drain being connected to said diode by a second electrical connector. |
地址 |
El Segundo CA US |