发明名称 Composite device with integrated diode
摘要 There are disclosed herein various implementations of composite semiconductor devices. In one implementation, such a composite semiconductor device includes a transition body formed over a diode, the transition body including more than one semiconductor layer. The composite semiconductor device also includes a transistor formed over the transition body. The diode may be connected across the transistor using through-semiconductor vias, external electrical connectors, or a combination of the two.
申请公布号 US9502398(B2) 申请公布日期 2016.11.22
申请号 US201514794370 申请日期 2015.07.08
申请人 Infineon Technologies Americas Corp. 发明人 Briere Michael A.
分类号 H01L29/778;H01L27/02;H01L29/16;H01L29/20;H01L23/522;H01L23/532;H01L29/861;H01L29/868;H01L29/417;H01L21/8258;H01L27/06 主分类号 H01L29/778
代理机构 Murphy, Bilak & Homiller, PLLC 代理人 Murphy, Bilak & Homiller, PLLC
主权项 1. A composite semiconductor device comprising: a diode including an anode and a cathode; a transition body formed over said cathode, said transition body including a plurality of semiconductor layers; a transistor formed over said transition body, said transistor including a source and a drain; said source being connected to said diode by a first electrical connector, wherein said first electrical connector is selected from the group consisting of a conductive metal clip, a conductive ribbon, and a bond wire; said drain being connected to said diode by a second electrical connector.
地址 El Segundo CA US