| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive material capable of reducing the layer thickness of a green sheet and imparting flexibility to the sheet, and to provide a photosensitive sheet and a method for manufacturing a multilayer circuit board using the same. <P>SOLUTION: The photosensitive sheet is manufactured using the photosensitive material containing at least a photosensitive resin, an organic binder and an inorganic powder having an average particle diameter of ≤3 μm and containing ≤10% of particles whose particle diameter is ≥5 μm, wherein when the photosensitive material is molded into a sheet of ≤100 μm thickness, the sheet is exposed with light energy of ≤400 mJ to cure the photosensitive resin, and the sheet after the curing is folded at 180°, the inside diameter of a fold at the time when the outside of the fold cracks is ≤1 cm. A multilayer circuit board is manufactured using the photosensitive sheet. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
