LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
摘要
Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening and side openings. The first and second lead frames pass through the housing to extend to an outside. A portion of each lead frame being exposed through the front opening. The light emitting device is in the front opening and electrically connected to the first and second lead frames. A protrusion protruding in a direction of the side opening is formed on an inner surface of the side opening.
申请公布号
WO2008156317(A2)
申请公布日期
2008.12.24
申请号
WO2008KR03480
申请日期
2008.06.19
申请人
LG INNOTEK CO., LTD;KONG, SUNG MIN;KIM, MYUNG GI;IM, HYEONG SEOK