发明名称 Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
摘要 Provided is a method including forming a film including a predetermined element, oxygen and at least one element selected from a group consisting of nitrogen, carbon and boron on a substrate by performing a cycle a predetermined number of times, the cycle including supplying a source gas to the substrate wherein the source gas contains the predetermined element, chlorine and oxygen with a chemical bond of the predetermined element and oxygen, and supplying a reactive gas to the substrate wherein the reactive gas contains the at least one element selected from the group consisting of nitrogen, carbon and boron.
申请公布号 US9443718(B2) 申请公布日期 2016.09.13
申请号 US201314102682 申请日期 2013.12.11
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 Harada Katsuyoshi;Hirose Yoshiro;Sano Atsushi
分类号 H01L21/31;H01L21/02;C23C16/30;C23C16/40;C23C16/455 主分类号 H01L21/31
代理机构 Volpe and Koenig, P.C. 代理人 Volpe and Koenig, P.C.
主权项 1. A method of manufacturing a semiconductor device, comprising forming a film including a predetermined element, oxygen and at least one element selected from a group consisting of nitrogen, carbon and boron on a substrate by performing a cycle a predetermined number of times, the cycle including alternatively performing: (a) supplying a source gas to the substrate wherein the source gas contains the predetermined element, chlorine and oxygen with a chemical bond of the predetermined element and oxygen; and (b) supplying a reactive gas to the substrate wherein the reactive gas contains the at least one element selected from the group consisting of nitrogen, carbon and boron, wherein a temperature of the substrate ranges from 700° C. to 900° C. when forming the film.
地址 Tokyo JP
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