发明名称 |
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium |
摘要 |
Provided is a method including forming a film including a predetermined element, oxygen and at least one element selected from a group consisting of nitrogen, carbon and boron on a substrate by performing a cycle a predetermined number of times, the cycle including supplying a source gas to the substrate wherein the source gas contains the predetermined element, chlorine and oxygen with a chemical bond of the predetermined element and oxygen, and supplying a reactive gas to the substrate wherein the reactive gas contains the at least one element selected from the group consisting of nitrogen, carbon and boron. |
申请公布号 |
US9443718(B2) |
申请公布日期 |
2016.09.13 |
申请号 |
US201314102682 |
申请日期 |
2013.12.11 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
Harada Katsuyoshi;Hirose Yoshiro;Sano Atsushi |
分类号 |
H01L21/31;H01L21/02;C23C16/30;C23C16/40;C23C16/455 |
主分类号 |
H01L21/31 |
代理机构 |
Volpe and Koenig, P.C. |
代理人 |
Volpe and Koenig, P.C. |
主权项 |
1. A method of manufacturing a semiconductor device, comprising forming a film including a predetermined element, oxygen and at least one element selected from a group consisting of nitrogen, carbon and boron on a substrate by performing a cycle a predetermined number of times, the cycle including alternatively performing:
(a) supplying a source gas to the substrate wherein the source gas contains the predetermined element, chlorine and oxygen with a chemical bond of the predetermined element and oxygen; and (b) supplying a reactive gas to the substrate wherein the reactive gas contains the at least one element selected from the group consisting of nitrogen, carbon and boron, wherein a temperature of the substrate ranges from 700° C. to 900° C. when forming the film. |
地址 |
Tokyo JP |