发明名称 |
Apparatus and method for wet cleaning wafers without ammonia vapor damage |
摘要 |
An apparatus and a method for cleaning wafers by a wet bench technique without incurring ammonia vapor damages to the wafer surface are provided. The apparatus of a wet cleaning tank consists of a tank body for holding a quantity of a cleaning solution therein; a conduit mounted through and vertical to a bottom wall of the tank body for feeding an ammonia-containing solution into the tank body through an outlet; and a cup-shaped container mounted in an upside-down position over the outlet of the conduit for blocking ammonia vapor generated by the ammonia-containing solution from reaching an upper cavity of the tank body. The method for cleaning wafers may be practiced by first positioning a conduit vertically through and with an outside wall of the conduit sealingly engaging a bottom wall of a liquid tank with an outlet end of the conduit immersed in a cleaning solution in the tank; then mounting a cup-shaped container in an upside-down position over the outlet end of the conduit to collect any ammonia vapors exiting the conduit and preventing the vapor from reaching an upper portion of the tank cavity.
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申请公布号 |
US2002092546(A1) |
申请公布日期 |
2002.07.18 |
申请号 |
US20010761417 |
申请日期 |
2001.01.16 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
TWU JIH-CHURNG;GUO MING-DAR;CHENG CHIA-CHUN |
分类号 |
B08B3/10;H01L21/00;(IPC1-7):B08B3/04 |
主分类号 |
B08B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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