COPPER FOIL LAMINATE WITH ADHESIVE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a copper foil laminate with an adhesive and its manufacturing method with which a copper-clad laminate board and a printed wiring board can be formed without generating a wrinkle or a flaw on the copper foil layer. SOLUTION: A copper foil laminate with an adhesive has an adhesive layer on one surface of a not more than 10μm thick copper foil and a protective layer made of a peelable resin film on the other surface of the copper foil wherein the peeling strength between the copper foil and the peelable protective layer is not more than 100 g/cm. The copper foil laminate with an adhesive can be made by forming a not more than 10μm thick copper foil layer on one surface of the resin film as a peelable protective layer and then forming an adhesive layer on the surface of the formed copper foil layer.