Heat dissipating assembly

摘要

An assembly for the dissipation of heat from an illumination structure of the type which includes one or more LEDs and a driver assembly operatively connected to the one or more LEDs. A primary heat sink is disposed in heat transferring relation to the components of a remainder of the illumination structure. A mount, also formed of a heat conductive material, is disposed in supporting or connected relation to the driver and in heat transferring relation to the primary heat sink. A compartment structure includes a hollow interior chamber, having heat insulating fluid disposed therein, and disposed in adjacent and/or aligned relation with the one LED so as to insulate it from heat generated by the driver assembly and other components of the light structure. The mount, primary heat sink and compartment structure are cooperatively disposed so as to define a flow path of heat away from the one or more LEDs to an area where it is dissipated exteriorly of the illumination structure.

主权项

1. An assembly for the dissipation of heat from an illumination structure, which includes at least one LED, said assembly comprising:
a driver assembly operatively connected to the one LED and defining a part of the illumination structure, a primary heat sink formed of heat conductive material and disposed in heat transferring relation to remaining portions of the illumination structure, a mount disposed in at least partially interconnecting relation between said driver assembly and remaining portions of the illumination structure, a compartment structure disposed and structured to at least partially insulate the one LED from heat generated by at least some of the remaining portions of the illumination structure, and said compartment structure at least partially disposed on said mount in adjacent relation to the one LED.