发明名称 |
Chip scale package structure for an image sensor |
摘要 |
A chip scale package (CSP) structure for an image sensor includes a semi-conductor image sense chip and multiple bonding pads formed on a top face of the semi-conductor image sense chip. A conducting wire extends from each of the multiple bonding pads by wire-bonding. Liquefied jelly-like material is covered with the top face of the semi-conductor image sense chip and forming a transparent layer on the top face of the semi-conductor image sense chip after drying up. The transparent layer has a thickness being equal to a height of each of the conduct wire relative to the top face of the semi-conductor image sense chip.
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申请公布号 |
US7173231(B2) |
申请公布日期 |
2007.02.06 |
申请号 |
US20030662433 |
申请日期 |
2003.09.16 |
申请人 |
CHEN WEN CHING |
发明人 |
CHEN WEN CHING |
分类号 |
H01L31/00;H01J5/02;H01L27/00;H01L31/0203;H01L31/0232 |
主分类号 |
H01L31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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