发明名称
摘要 PURPOSE: To perform cooling of a power supply device with a high efficiency using a simple configuration through omission of wirings and build the body of device to be compactified and light in weight. CONSTITUTION: A power supply base board 13 is installed parallel with a rear cover 23, and a main motor unit 17 is installed in such a way as penetrating the board 13. A fan 18 has a radial impeller, and the external air inhaled from a louver 25a runs against a heat radiation plate 16 to cool a semiconductor 15, cools it, and is exhausted from another louver 25b. According to this configuration in which the impeller is attached directly to the rotor 19 and a main motor unit 17 penetrates the board 18, the width of the body can be lessened, and the main motor unit can remain without wirings, and the body can be made compact and light in weight.
申请公布号 JP3630763(B2) 申请公布日期 2005.03.23
申请号 JP19950096278 申请日期 1995.03.29
申请人 发明人
分类号 G03G21/20;G03G15/00;G03G21/00 主分类号 G03G21/20
代理机构 代理人
主权项
地址