| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition and a carrier material with resin by which a solder bump is melted to realize interlayer electrical bonding on a circuit board, and to provide a multilayer printed wiring board. SOLUTION: The resin composition is used to form a resin layer made of a sheet-like carrier material with resin, and it contains an epoxy-based adhesive agent of which gel time is 40-60 min at 120°C and a compound having carboxyl group and a phenol hydroxyl group. In addition, the epoxy-based adhesive agent contains an epoxy resin having a dicyclopentadiene frame. COPYRIGHT: (C)2005,JPO&NCIPI |
