发明名称 |
PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
摘要 |
<p>A photosensitive adhesive composition contains (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radioactive polymerizable compound and (D) a photosensitive adhesive compound containing a photo initiator. The photo initiator (D) contains a photo initiator which has a function of promoting reaction of polymerization and/or curing of the epoxy resin by at least irradiation of a radioactive ray (D1).</p> |
申请公布号 |
KR20100009537(A) |
申请公布日期 |
2010.01.27 |
申请号 |
KR20097018987 |
申请日期 |
2008.03.19 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MITSUKURA KAZUYUKI;KAWAMORI TAKASHI;MASUKO TAKASHI;KATOGI SHIGEKI |
分类号 |
C09J179/08;C09J163/00;G03F7/04 |
主分类号 |
C09J179/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|