发明名称 LAMINATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide lamination structure which is high in the interlayer peel strength between a substrate, especially a polypropylene layer, and a fiber-reinforced thermosetting resin layer at room temperature and also at higher temperatures and can control the thermal expansion of, for example, a main pipe constituting a substrate layer. SOLUTION: In the lamination structure with the fiber-reinforced thermosetting resin layer laminated on the substrate, a surface treatment layer, a metal layer, and the fiber-reinforced thermosetting resin layer are laminated in turn on the substrate. The substrate is made of a nonmetallic material and subjected to surface treatment. The surface treatment is performed by a sand blasting method. The metal layer is subjected to surface treatment or dotted with metal. In the lamination structure, a primer layer can exist between the metal layer and the fiber-reinforced thermosetting resin layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006150759(A) 申请公布日期 2006.06.15
申请号 JP20040344833 申请日期 2004.11.29
申请人 ASAHI ORGANIC CHEM IND CO LTD 发明人 UCHIDA HITOSHI;YANAGIDA MASAKATSU;KOMATSU KENICHI
分类号 B32B15/08;B32B1/08;B32B5/28;C09J5/02;C09J175/04 主分类号 B32B15/08
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