发明名称 PERPENDICULAR MAGNETIC TUNNELING JUNCTION (MTJ) FOR IMPROVED MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) PROCESS
摘要 A method of forming a magnetoresistive random access memory (MRAM) device including a perpendicular MTJ (magnetic tunnel junction) is provided. The method includes forming a magnetic tunneling junction (MTJ) over a bottom electrode layer. A top electrode layer is formed over an upper surface of the MTJ, and a hard mask is formed over an upper surface of the top electrode layer. A first etch is performed through the top electrode layer, through regions of the MTJ unmasked by the hard mask, to form a top electrode and an etched MTJ. Sidewall spacers are formed extending from an upper surface of the hard mask or the top electrode, along sidewalls of the top electrode and the etched MTJ, to a point below or about even with an upper surface of the bottom electrode. A resulting MRAM device structure is also provided.
申请公布号 US2016268499(A1) 申请公布日期 2016.09.15
申请号 US201514645683 申请日期 2015.03.12
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 You Wen-Chun;Tu Kuo-Chi;Chang Chih-Yang;Chen Hsia-Wei;Yang Chin-Chieh;Shih Sheng-Hung;Chu Wen-Ting;Liao Yu-Wen
分类号 H01L43/08;G11C11/16;H01L43/10;H01L43/02;H01L43/12 主分类号 H01L43/08
代理机构 代理人
主权项 1. A method for manufacturing a magnetoresistive random-access memory (MRAM) cell, the method including: forming a magnetic tunneling junction (MTJ) over a bottom electrode layer; forming a top electrode layer over an upper surface of the MTJ; forming a hard mask over an upper surface of the top electrode layer; performing a first etch through the top electrode layer through regions of the MTJ unmasked by the hard mask, to form a top electrode and an etched MTJ; and forming sidewall spacers extending from an upper surface of the hard mask or the top electrode, along sidewalls of the top electrode and the etched MTJ, to a point below or about even with an the upper surface of the bottom electrode layer.
地址 Hsin-Chu TW