PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

摘要

A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric layer; an electronic element disposed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; a plurality of conductive posts formed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; and an encapsulant formed on the first surface of the dielectric layer and encapsulating the electronic element and the conductive posts. Upper surfaces of the conductive posts are exposed from the encapsulant so as to allow another electronic element to be disposed on the conductive posts and electrically connected to the circuit sub-layer through the conductive posts, thereby overcoming the conventional drawback that another electronic element can only be disposed on a lower side of a package structure and improving the functionality of the package structure.

主权项

1. A method for fabricating a package structure, comprising the steps of:
providing a dielectric layer having a circuit sub-layer, wherein the dielectric layer has a first surface and a second surface opposite to the first surface; disposing an electronic element on the first surface of the dielectric layer, wherein the electronic element is electrically connected to the circuit sub-layer; forming a plurality of conductive posts on the first surface of the dielectric layer, wherein the conductive posts are electrically connected to the circuit sub-layer; and forming an encapsulant on the first surface of the dielectric layer to encapsulate the electronic element and the conductive posts, wherein upper surfaces of the conductive posts are exposed from the encapsulant.