| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mount quartz device preventing cracks from occurring in solder because of a difference in a thermal expansion coefficient to a set substrate. SOLUTION: The surface mounting quartz device has a rectangular vessel body 3 that has a circuit terminal 8 of the set substrate 7 and a mounted electrode 5 joined by the solder 9 at least at both sides of an outer bottom surface and is made of ceramic. Inside the vessel body 3, at least a crystal chip 2 is stored. In the surface mount quartz device, a projection 11, which is thicker than the mounted electrode 5, is provided on the outer bottom surface of the vessel body 3, and the thickness of the solder 9 is increased between the mounted electrode 5 and the circuit terminal 8. COPYRIGHT: (C)2009,JPO&INPIT
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