Metal bump structure for use in driver IC and method for forming the same

摘要

A metal bump structure for use in a driver IC includes a passivation layer disposed on a metal pad and defining a recess on the metal pad, an adhesion layer in said recess, on the metal pad and on the passivation layer, a metal bump disposed in the recess and completely covering the adhesion layer, and a capping layer disposed on the metal bump and completely covering the metal bump so that the metal bump is not exposed to an ambient atmosphere.

主权项

1. A metal bump structure for use in a driver IC, comprising:
a metal pad; a passivation layer disposed on said metal pad and defining a recess disposed on said metal pad; an adhesion layer disposed in said recess, disposed on said metal pad and partially disposed on said passivation layer, wherein said adhesion layer is in direct contact with said metal pad and with said passivation layer; a metal bump partially disposed in said recess and covering said adhesion layer; and a capping layer disposed on said metal bump and covering said metal bump so that said metal bump is not exposed to an ambient atmosphere, wherein a notch is surrounded by said capping layer, by said adhesion layer and by said passivation layer and disposed beneath said metal bump.