| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding material and a bonding method capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to the bonding material using a metal particle having an average particle diameter of 100 nm or the less. <P>SOLUTION: A bonding material comprises: at least one or more of a metal particle precursor selected from particles of a metal oxide, a metal carbonate, and a metal carboxylate having an average particle diameter of 1 nm to 50 μm; and a reducing agent composed of an organic substance. In the bonding material the content of the metal particle precursor is more than 50 pts.mass and not more than 99 pts.mass per 100 pts.mass of the bonding material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
