METHOD OF FORMING SOLDER BUMPS AND SOLDER BUMP-FORMING ASSEMBLY

摘要

A bump-forming assembly for use in forming solder bumps on a workpiece includes a heat-resistant sheet having a plurality of holes formed therein and a solder paste disposed in the holes. The assembly can be used to form solder bumps by placing the assembly opposite a workpiece with each of the holes in the heat-resistant sheet aligned with an electrical contact on the workpiece, and heating the assembly to melt the solder paste and form mounds of molten solder adhering to the contacts. The molten solder is then cooled, and the heat-resistant sheet is removed from the workpiece.