| 摘要 |
PROBLEM TO BE SOLVED: To improve the heat radiation efficiency and manufacturing efficiency of an electronic apparatus.SOLUTION: An electronic apparatus 1 includes: a heat sink 2; a substrate 3 disposed on an arrangement surface 11a of the heat sink 2; a cylindrical frame body 4 disposed on the arrangement surface 11a so as to enclose the substrate 3; and a sealing resin 5 which fills the interior of the frame body 4 and seals the substrate 3. Recesses 13 which are recessed in a direction perpendicular to an axial direction of the frame body 4 are formed at the heat sink 2. Claw parts 21, which are disposed so as to sandwich the heat sink 2 and engage with the recesses 13, are formed at the frame body 4. In the electronic apparatus 1, an axial first end part 4A of the frame body 4 is pressed against the arrangement surface 11a in the state that the claw parts 21 engage with the recesses 13. |
