INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS

摘要

PURPOSE: An inductively coupled plasma processing apparatus is provided to reduce a power loss due to an eddy current by decreasing an eddy current area in a support frame. CONSTITUTION: A chamber body(110) includes an opening unit. A substrate support stand(130) is installed in the chamber body and supports a substrate(10). A gas spray unit(150) sprays gas to a processing space(S). A dielectric assembly(200) includes a plurality of dielectrics. An antenna(400) forms an induction field in the processing space.