POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH METAL PART, POWER MODULE WITH METAL PART, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE WITH METAL PART

摘要

A power module substrate includes an insulating layer, a circuit layer that is formed on a first surface of the insulating layer, and a metal layer that is formed on a second surface of the insulating layer, in which a first base layer is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.

主权项

1. A power module substrate comprising:
an insulating layer; a circuit layer that is formed on a first surface of the insulating layer; and a metal layer that is formed on a second surface of the insulating layer, wherein a first base layer, to which a bonding layer composed of a sintered body of a bonding material including at least one of metal particles and metal oxide particles is bonded, is laminated on a surface of the metal layer on an opposite side of the surface, to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.