发明名称 LAMINATED CERAMIC PACKAGE AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laminated ceramic package that achieves further reduction in man-hour than a conventional one, and its manufacturing method. <P>SOLUTION: The laminated ceramic package is composed of a laminated ceramic substrate 1 in which a cavity 10 is formed on its surface, a cap 2 joined to the surface of the laminated ceramic substrate 1, and an electronic device 3 stored in the cavity 10 of the laminated ceramic substrate 1. The rear face of the laminated ceramic substrate 1 has a plurality of external electrodes 7 connected with the electronic device 3 through each conductor filling part 6. The electronic device 3 is arranged on the inner face of the cap 2. A plurality of internal electrodes 5 are interposed between opposing faces of the laminated ceramic substrate 1 and the cap 2 so as to connect the electronic device 3 with each conductor filling part 6 of the laminated ceramic substrate 1. A metal sealing part 4 is also interposed between the opposing faces of the laminated ceramic substrate and the cap so as to seal a space formed between the laminated ceramic substrate 1 and the cap 2 while surrounding the internal electrodes 5. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008211062(A) 申请公布日期 2008.09.11
申请号 JP20070047737 申请日期 2007.02.27
申请人 SANYO ELECTRIC CO LTD 发明人 NOGUCHI HITOSHI
分类号 H01L23/02 主分类号 H01L23/02
代理机构 代理人
主权项
地址