CAP FOR HERMETIC SEALING AND METHOD OF PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a cap for hermetic sealing adapted to make for improving sealability and down-sizing. SOLUTION: The hermetic sealing cap is intended for using for an electronic component housing package to house electronic components 34. It includes a cavity (a concave portion) and a flange portion 41a provided in both end portions of the cavity. The radius of curvature measures longer than 0 mm and shorter than 0.1 mm at the corner 41b of the sealing-side inner face of the flange portion 41a. COPYRIGHT: (C)2010,JPO&INPIT