发明名称 |
Arrangement of integrated circuits in a memory module |
摘要 |
Integrated circuits utilizing standard commercial packaging are arranged on a printed circuit board to allow the production of 1-Gigabyte and 2-Gigabyte capacity memory modules. A first row of integrated circuits is oriented in an opposite orientation to a second row of integrated circuits. The integrated circuits in a first half of the first row and in the corresponding half of the second row are connected via a signal trace to a first register. The integrated circuits in a second half of the first row and in the corresponding half of the second row are connected to a second register. Each register processes a non-contiguous subset of the bits in each data word.
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申请公布号 |
US2004184299(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
US20040765420 |
申请日期 |
2004.01.27 |
申请人 |
BHAKTA JAYESH R.;PAULEY ROBERT S. |
发明人 |
BHAKTA JAYESH R.;PAULEY ROBERT S. |
分类号 |
G11C5/00;H05K1/02;H05K1/18;(IPC1-7):G11C5/06 |
主分类号 |
G11C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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