发明名称 MOLDING APPARATUS AND MOLDING METHOD FOR MOLDED OBJECT
摘要 PROBLEM TO BE SOLVED: To provide a molding apparatus that can manufacture a molded object with high accuracy.SOLUTION: A molding apparatus includes: a mounting part 150 for mounting a sheet comprising fibers bound by a thermoplastic resin; a cutting part 160 for cutting a first sheet mounted on the mounting part 150 into an effective region constituting a molded object and an unnecessary region not constituting the molded object, on the basis of a molding data; a stacking part 140 for stacking a second sheet on the first sheet cut by the cutting part 160; and a heating part 170 for heating the second sheet to melt at least a part of the thermoplastic resin to cause the second sheet adhere to the first sheet. The apparatus molds an object by repeating the above steps of cutting a sheet by the cutting part 160, stacking a sheet by the stacking part 140, and adhesion of sheets by the heating part 170.SELECTED DRAWING: Figure 1
申请公布号 JP2016179658(A) 申请公布日期 2016.10.13
申请号 JP20150062199 申请日期 2015.03.25
申请人 SEIKO EPSON CORP 发明人 TAKANO HIDEHIRO
分类号 B29C67/00;B33Y10/00;B33Y30/00 主分类号 B29C67/00
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