| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method which perform thermal treatment on a substrate in sufficiently uniform temperature distribution, and to provide a recording medium.SOLUTION: A heating/cooling unit U2 includes: a heat plate 10 which supports a wafer W horizontally placed and heats the wafer W; a light radiation part 14 which radiates light for facilitating a reaction progressed by heating of the heat plate 10 to the wafer W; a horizontal transfer part 24 which transfers a light source 23 of the light radiation part 14 or the wafer W in a horizontal direction and thereby moves a light radiation position over an entire region of a treatment object portion of the wafer W; and a control part 15 which controls the light radiation part 14 and the horizontal transfer part 24 thereby adjusting an amount of radiation light for each radiation position. |
