| 摘要 |
PROBLEM TO BE SOLVED: To provide an improvement in heat dissipation characteristics and enhancement in proof strength against the variation of potential of power supply or ground caused by simultaneous switching by the side of an IC chip with respect to a package of integrated circuits. SOLUTION: An IC package 10 is provided with a substrate 6 in which an IC chip 4 is mounted, and a covering section 8 for covering the IC chip mounted in the substrate. In either or both sides of the substrate or the covering section, it has single or a plurality of laminated power supply layers 21, 22, 23, 24 and 25, and ground layers 31, 32, 33, 34, 35 and 36. It comprises single or a plurality of built-in capacitors C1-C9 by arranging oppositely and sandwiching high dielectric layers 41-49 between the power supply layer and the ground layer. Further, an IC package is constituted such that an inner side conductor layer 35 contacted with an IC chip and an outside conductor layer 36 are connected by intervening thermal vias 101-106 and 111-116. It is also provided with covering conductors 131-13n. COPYRIGHT: (C)2007,JPO&INPIT |
