CONDUCTIVE PATTERN-FORMING COMPOSITION AND METHOD

摘要

PURPOSE: A composition for forming conductive patterns is provided to miniaturize a conductive circuit, and to manufacture a semiconductor circuit with high reliability. CONSTITUTION: A composition for forming conductive patterns by mixing conductive particles with maximum diameter of 1 micron or less in a silicon rubber composition containing curable organopolysiloxane and a curing agent. The conductive particle is silica of which the surface is electroplated with metal. A forming method of the conductive patterns comprises a step of rubberization by spreading a composition for conductive pattern forming by a printing method, and curing the composition.