SEMICONDUCTOR PACKAGE MODULES, MEMORY CARDS INCLUDING THE SAME, AND ELECTRONIC SYSTEMS INCLUDING THE SAME

摘要

A semiconductor package module may include a first substrate, and a second substrate disposed to face the first substrate. The semiconductor package module may include an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires. Portions of the plurality of wires may be twisted and wound together and may be bent to extend in a predetermined direction.

主权项

1. A semiconductor package module comprising:
a first substrate; a second substrate disposed to face the first substrate; and an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires, wherein portions of the plurality of wires are twisted and wound together and are bent to extend in a predetermined direction.