| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for piercing by laser beam capable of exactly dealing with a work with a large size or with a curved surface. SOLUTION: On a plane substrate 1 an adhesive layer 2 is formed, and on this adhesive layer 2 a work piece 3 (e.g. 2 polymer film) is adhesively retained. A laser beam 4 is projected on the work piece 3 from the side of this work piece 3, and piercing is carried out by abrasion action. In this case, the laser beam 4 is projected for a sufficiently enough time to complete piercing of a hole 3a on the work piece 3. At this moment, the light passed through the work piece 3 is absorbed by the adhesive layer 2, so the effect of reflection on the rear side of the work piece 3 by the plane substrate 1 is decreased. After that, by removing the adhesive layer 2 and the plane substrate 1 off the work piece 3, a product 5 is obtained.</p> |
