DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.

主权项

1. A device module manufactured by the method of claim 12, the device module comprising:
a plastic part made of the plastic material injected into the cavity of the first and second dies; the device being embedded in the plastic part; the holder embedded in the plastic part, the holder including the exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close the housing recess of the first die; and the external connection partially fixed to the holder, the external connection including:
an embedded portion being the first end portion of the external connection and including the first end of the external connection connected to the device, the embedded portion being embedded in the plastic part, anda lead-out portion being the second end portion of the external connection, the lead-out portion being embedded in the plastic part and being led out of the plastic part in the thickness direction, or alternatively the lead-out portion being led through and out of the holder in the thickness direction.