WIRING BOARD AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: A wiring board and a semiconductor device are provided to protect both sides of an insulating layer and to reduce the difference of stress applied to the both sides of the insulating layer. CONSTITUTION: A solder resist layer(102) is formed a supporting substrate. An opening is formed by patterning the solder resist layer. Ultra-violet rays are radiated to the solder resist layer through a mask pattern. An electrode(103) is buried within the opening. An insulating layer(104) is formed on the solder resist layer and the electrode. A pattern wire(106) connected to a via plug(105) is formed on the insulating layer with a semi-additive method. A wiring layer is comprised of the via plug and the pattern wire.