| 发明名称 |
SOLDERING THREE DIMENSIONAL INTEGRATED CIRCUITS |
| 摘要 |
A method for soldering three-dimensional integrated circuits is provided. A three-dimensional integrated circuit is heated to a base temperature, wherein the base temperature is lower than the melting point of a solder, and wherein the three-dimensional integrated circuit includes a plurality of solder bumps. A first on-chip heat source reflows a first portion of the plurality of solder bumps that is within a first local-hot-zone. A second on-chip heat source reflows a second portion of the plurality of solder bumps that is within a second local-hot-zone. |
| 申请公布号 |
US2016293497(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201514672654 |
申请日期 |
2015.03.30 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Eckert Martin;Kunigkeit Eckhard;Torreiter Otto A.;Trianni Quintino L. |
| 分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
heating a three-dimensional integrated circuit to a base temperature, wherein the base temperature is below a melting temperature of a solder, and wherein the three-dimensional integrated circuit includes a plurality of solder bumps disposed between vertically stacked dies; activating a first on-chip heat source to reflow a first portion of the plurality of solder bumps that is within a first local-hot-zone, wherein the first local-hot-zone has a temperature that is equal to or higher than the melting temperature of the solder; and activating a second on-chip heat source to reflow a second portion of the plurality of solder bumps that is within a second local-hot-zone, wherein the second local-hot-zone has a temperature that is equal to or higher than the melting temperature of the solder. |
| 地址 |
Armonk NY US |
