| 摘要 |
The present invention relates to an apparatus for separating solid thin plates, capable of separating the outermost solid thin plates from multi-layered bonded substrates in which a plurality of solid thin plates are bonded, without causing damage to the thin plates. The apparatus for separating solid thin plates, according to the present invention, comprises: a lower chuck for sucking, by means of a vacuum suction force, the lower surface of the lowest substrate among the multi-layered bonded substrates; an upper chuck for sucking, by means of a vacuum suction force, the upper surface of the top substrate among the multi-layered bonded substrates; a lower transforming ring formed into the shape of a closed curve at the edge of the upper surface of the lower chuck, for forming an airtight space between the upper surface of the lower chuck and the lower surface of the lowest substrate among the multi-layered bonded substrates; an upper transforming ring formed into the shape of a closed curve at the edge of the lower surface of the upper chuck, for forming an airtight space between the lower surface of the upper chuck and the upper surface of the top substrate among the multi-layered bonded substrates; a lower chuck-vertically driving means for driving the lower chuck vertically; and an upper chuck-vertically driving means for driving the upper chuck vertically. |
