发明名称 |
High frequency cable, high frequency coil and method for manufacturing high frequency cable |
摘要 |
A method for manufacturing a high frequency cable that includes covering a central conductor made from aluminum or an aluminum alloy with a covering layer made from copper; and wire drawing of the central conductor covered by the covering layer using dies at multiple steps, each of the dies having a cross-section reduction rate of 20% to 29% with an entire reduction angle of 16 degrees, to form a fiber-like structure in a longitudinal direction in the covering layer, and to form an intermetallic compound layer having greater volume resistivity than the covering layer between the central conductor and the covering layer. |
申请公布号 |
US9478328(B2) |
申请公布日期 |
2016.10.25 |
申请号 |
US201414336507 |
申请日期 |
2014.07.21 |
申请人 |
FUJIKURA LTD. |
发明人 |
Shinmoto Takashi;Yoshida Shotaro;Katayama Shinji;Toda Taikou;Kato Takamasa;Daibo Masanori;Kawakawi Akio |
分类号 |
B21C1/00;B23K20/00;B21C3/04;H01B1/02;H01B7/30;B23K20/233;C22C21/00;B32B15/01;H01B5/02;H01B13/00;C22C9/00;C23C28/02;H01F27/28 |
主分类号 |
B21C1/00 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A method for manufacturing a high frequency cable, comprising:
covering a central conductor made from aluminum or an aluminum alloy with a covering layer made from copper; and wire drawing of the central conductor covered by the covering layer using dies at multiple steps, each of the dies having a cross-section reduction rate of 20% to 29% with an entire reduction angle of 16 degrees, to form a fiber-like structure in a longitudinal direction in the covering layer, and to form an intermetallic compound layer having greater volume resistivity than the covering layer between the central conductor and the covering layer. |
地址 |
Tokyo JP |