| 发明名称 |
INTEGRATED CIRCUIT CHIP EXTRACTOR AND METHOD FOR OPERATING THE SAME |
| 摘要 |
The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel. |
| 申请公布号 |
US2016353623(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615139185 |
申请日期 |
2016.04.26 |
| 申请人 |
BOE TECHNOLOGY GROUP CO., LTD. ;HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. |
发明人 |
HOU Yongkang;ZHANG Yu;YANG Jianlei |
| 分类号 |
H05K13/04 |
主分类号 |
H05K13/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit (IC) chip extractor for removing an IC chip from a panel, comprising a base plate and a heating head arranged on the base plate, wherein the heating head comprises a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion of the IC chip adjacent to a center of the panel. |
| 地址 |
Beijing CN |
