| 摘要 |
A method for manufacturing an electronic assembly using direct writing with fabricated foils is provided. The electronic assembly may include one or more foil substrates (210) and one or more elements (220, 222, 224, 226, 228, 230.). The elements may be produced by an additive manufacturing process. Moreover, the elements may be produced in the same plane or out of plain with one or more foil substrates. The elements may also be various structures, including, for example, connectors, electrical components (e.g., a resistor, a capacitor, a switch, and/or the like), and/or any other suitable electrical elements and/or structures. |
