METHOD FOR FORMING ANTI STICTION COATING AND ANTI STICTION COATING THEREOF

摘要

A method for forming an anti-stiction coating on a surface of a semiconductor device is provided. Using atomic layer deposition (ALD) processes to activate surface prior to anti-stiction coating deposition, anti-stiction coating having strong chemical bonding to the surface is obtained.

主权项

1. A method for forming an anti-stiction coating on a surface of a semiconductor device, comprising:
providing the surface of the semiconductor device to a first reaction chamber; performing an atomic layer deposition (ALD) process to the semiconductor device, wherein the atomic layer deposition process is performed with alternating reaction cycles of trimethylaluminum (TMA) and water (H2O) for depositing an aluminum oxide film on the surface of the semiconductor device in the first reaction chamber; terminating the ALD process with one TMA cycle to create a reactive surface within the first reaction chamber; transferring the semiconductor device from the first reaction chamber to a second reaction chamber under a controlled environment; providing at least one fluorinated species to the second reaction chamber; and forming an anti-stiction coating on the surface of the semiconductor device through reactions of the fluorinated species and TMA.