| 摘要 |
A semiconductor light-emitting device in which a light-emitting diode including a light-emitting layer is placed directly on the bottom of a cup-shaped case or placed above the case bottom with a submount disposed therebetween includes a transparent primary sealing member that seals a side region, located under the light-emitting layer, surrounding the light-emitting diode that is fixed in the case; a transparent secondary sealing member disposed on the primary sealing member; and a uniform deposition layer formed by depositing phosphor particles or light diffuser particles contained in a material for forming the secondary sealing member. The phosphor particles or the light diffuser particles are deposited on the upper surface of the light-emitting diode and the upper surface of the primary sealing member to form a uniform layer that is as thin as a one-particle to five-particle layer.
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