发明名称 METHOD AND APPARATUS FOR COMPRESSION MOLDING OF REFLECTOR FOR LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and apparatus for compression molding of a reflector for a light emitting device, by which the utilization rate of a mold resin is improved to cause no resin flash, thereby enhancing the molding quality. <P>SOLUTION: The reflector 3 is compression molded by supplying the mold resin 26 to a cavity recess 16 sucking and holding a release film 21 and filling it around a press pin 17, positioning a workpiece in the cavity recess 16 and placing it while being brought into abutment with a clamper block 14 and the press pin 17 via the release film 21, clamping the workpiece by a mold 8, and relatively moving the bottom part of the cavity recess 16 so as to be close to the workpiece, by further clamping operation of the workpiece. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013043391(A) 申请公布日期 2013.03.04
申请号 JP20110183501 申请日期 2011.08.25
申请人 APIC YAMADA CORP 发明人 IKEDA MASANOBU;NAKAYAMA HIDEO
分类号 B29C43/18;B29C43/56;B29K63/00;H01L33/60 主分类号 B29C43/18
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