| 摘要 |
PROBLEM TO BE SOLVED: To cause an upper die surface 10a of a compression resin encapsulation device A to suck a substrate W with high efficiency and cause the upper die surface 10a to successfully hold the substrate W in the case where a central part of the substrate W placed on a substrate transfer plate part 41 hangs down and curves to deform under its own weight.SOLUTION: A substrate transfer and feed method and a substrate transfer and feed device, which perform a posture correction process of a substrate W when transferring the substrate W on which a plurality of electronic components 30 are held on a surface to a position under an upper die surface 10a of a compression resin encapsulation device A with a surface side of the substrate W on which the electronic components 30 are held lying face downward and with a rear face side of the wafer W on the opposite side to the surface side being sucked and held by the upper die surface 10 of the compression resin encapsulation device A, of correcting a curved and deformed posture of the substrate W to a substantially horizontal posture position by supplying compressed air to inside a storage recess 41b of a substrate transfer plate part 41 to push upward a central part of the substrate W, which hangs down and curves and deforms under its own weight. |
